Maps

Semiconductor Supply Chain

The detailed semiconductor value chain, showing where the fund's silicon holdings sit + on what they depend. Companion: AI Supply Chain Map, Semiconductors.

The Full Chain (with PCA SOF holdings in bold)#

 1. EDA + IP              Synopsys, Cadence, Arm           (not held)
 2. EQUIPMENT             ASML (EUV), Applied Materials,    (not held)
                          Lam, Tokyo Electron,
                          **Disco Corporation** (dicing/grinding/packaging)
 3. MATERIALS             Wafers (Shin-Etsu/SUMCO),         (not held)
                          photoresist, specialty gases
 4. FOUNDRY/FAB           **TSMC** (leading-edge),      Samsung, Intel (not held)
 5. CHIP DESIGN (fabless) **NVIDIA** (GPU),
                          **Marvell Technology** (networking/ASIC)
 6. MEMORY (IDM)          **Micron Technology** (DRAM/NAND/HBM),
                          SK Hynix, Samsung (not held)
 7. ADVANCED PACKAGING    TSMC CoWoS/SoIC, OSATs            (Disco tools used here)
 8. SYSTEMS/OEM           NVIDIA systems, ODMs              
 9. END BUYERS            **Hyperscalers** (MSFT/AMZN/GOOGL/META)

Where Each Holding Sits + Depends#

| Holding | Layer | Depends upstream on | Sells downstream to | |, -|, -|, -|, -| | Disco Corporation | Equipment | Precision components (internal IP) | TSMC, Micron Technology, OSATs | | TSMC | Foundry | ASML EUV (chokepoint), AMAT/Lam/TEL, Disco Corporation, wafers | NVIDIA, Marvell Technology, hyperscaler silicon | | NVIDIA | Fabless design | TSMC (fab), Micron Technology (HBM), CoWoS packaging | Hyperscalers | | Marvell Technology | Fabless design | TSMC (fab) | Hyperscalers (ASIC/optics) | | Micron Technology | Memory IDM | Equipment incl. Disco Corporation, ASML; own fabs | NVIDIA, hyperscalers |


The Chokepoint Stack (most → least concentrated)#

  1. EUV lithography, ASML (a literal monopoly; not held, but TSMC's critical dependency). A systemic risk to the whole chain.
  2. Leading-edge foundry, TSMC (the held chokepoint). → Taiwan Strait Risk.
  3. Advanced packaging, TSMC CoWoS (gates NVIDIA supply; uses Disco Corporation tools).
  4. HBM, Micron Technology/Hynix/Samsung (3 suppliers).
  5. Dicing/grinding, Disco Corporation (~70-80% share niche monopoly).

The fund owns four of the five held-able chokepoints (TSMC, Micron, Disco, + the GPU design layer NVIDIA), deliberate concentration in the points of maximum pricing power.


Geopolitical Geography Of The Chain#

| Node | Location | Risk | |, -|, -|, -| | EUV (ASML) | Netherlands | Export-control leverage | | Leading-edge fab (TSMC) | Taiwan | Taiwan Strait Risk, the systemic tail | | Memory (Micron Technology) | US/Taiwan/Japan/Singapore | China sales restrictions | | Equipment (Disco Corporation) | Japan | China export controls | | Packaging | Taiwan/Asia | Concentration |

The chain is Asia-centric + Taiwan-pivotal: the fund's largest cross-cutting geopolitical exposure. → Geopolitical Risk, Overlap & Diversification Map.


Linked Notes#

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